Siemens Partners with Alphawave Semi for Advanced Silicon IP Solutions

Siemens has signed an exclusive OEM agreement with Alphawave Semi to market high-speed interconnect silicon IP solutions. This collaboration aims to meet the growing demand for scalable chip architectures in areas including:

  • Artificial intelligence (AI)
  • High-performance computing (HPC)
  • Data networking
  • Autonomous vehicles
  • Hyperscaling
  • Storage

Comprehensive Silicon IP Solutions

The partnership integrates Alphawave Semi’s high-speed interconnect silicon IP with Siemens’ advanced EDA tools, streamlining the development of next-generation semiconductors. Tony Pialis, President and CEO of Alphawave Semi, emphasized that this agreement simplifies and accelerates the process for SoC developers to incorporate Alphawave Semi’s IP, ultimately reducing interconnect bottlenecks and expanding customer reach. 

The key offerings include:

  • PHY IP: A versatile IP portfolio supporting Ethernet, PCIe, CXL, HBM and UCIe (Die-to-Die) implementations, covering data rates from 1Gbps to 224Gbps across more than 30 industry protocols
  • Controller IP: A comprehensive interface controller solution for data centers, telecommunications, cloud computing, AI, neural processing units (NPUs) and 5g wireless applications
  • Subsystems Platforms: Integrated PHY and interface controller IP offerings for efficient, comprehensive design solutions

Addressing the Demands for Custom Silicon and ASICs

With the increasing need for chiplet-based application-specific integrated circuits (ASICs) and custom silicon, this partnership aims to provide spec-to-silicon solutions. These solutions streamline the development process from initial concept to final production, accelerating time-to-market. Mike Ellow, CEO of Siemens EDA, emphasized that integrating Alphawave Semi’s silicon IP brings cutting-edge technology to customers, driving rapid innovation across various industries.

The strategic collaboration delivers state-of-the-art IP solutions that address complex connectivity challenges at advanced process nodes, enhancing the efficiency and performance of next-gen semiconductor designs.

Read more about the partnership from the official Siemens press release.

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