Alchip’s New Automotive ASIC Platform

In a significant advancement for the automotive industry, Alchip Technologies, Ltd. has recently introduced a groundbreaking Automotive ASIC platform. This innovative platform is tailored to meet the intricate requirements of the global automotive sector, marking a pivotal development in automotive technology.

The new Automotive platform is specifically designed to cater to the unique ASIC design needs of international automotive IC module and component manufacturers, along with automotive companies themselves. The platform has already garnered considerable attention from a diverse range of companies spanning Europe, Japan, the United States, and Asia.

Comprising six essential modules, this platform is a comprehensive solution for the automotive industry. These modules include Design for Autonomous Driving (AD)/Advanced Driver Assistance System (ADAS), Design for Safety, Design for Test, Design for Reliability, Automotive Chip Sign-off, and Automotive Chip Manufacturing (MFG) Service.

The platform kicks off with the Design for AD/ADAS module, boasting ultra-scale design capabilities that integrate both the Central Processing Unit (CPU) and Neural Processing Unit (NPU) into a compact die size. This integration is crucial for achieving the higher performance and reduced power consumption that modern automotive applications demand.

Following this, the Design for Safety module adheres to the ISO26262 prescribed flow, incorporating necessary isolated TMR/Lock-Step design methodologies. This module is bolstered by an experienced safety manager and includes a Development Interface Agreement (DIA) to define the ongoing relationship between manufacturers and suppliers throughout the automotive safety lifecycle.

Enhanced Electromigration (EM) for silicon lifecycle management is a key feature of the Design for Reliability module. This module also focuses on AEC-Q grade IP sourcing and implementation.

The Automotive Chip
Manufacturing Service collaborates with IATF16949 approved manufacturing suppliers, offering extensive services including tri-temp testing according to target AEC-Q grade, alongside automotive wafer, substrate, assembly, and burn-in processes.

For testing, the platform’s Design for Test capabilities include In System Test (IST) and MBIST/LBIST design, as well as critical and redundancy logic for yield harvest, automotive-level ATPG coverage, and physical-aware ATPG.

The platform culminates with the final sign-off module, which encompasses an aging library based on customer mission profiles, support for OD/UD/AVS/DVFS libraries, and the ultimate Design for Manufacturing sign-off.

Johnny Shen, CEO of Alchip, expressed his enthusiasm about this launch: “This is a monumental leap in ADAS and autonomous driving ASIC components for the worldwide automotive electronics industry. It significantly accelerates the development and market introduction of vital safety-critical ADAS applications and propels forward the innovation in increasingly complex autonomous driving technologies.”

The newly launched Automotive platform is now accessible through Alchip’s offices in Taipei, Silicon Valley, Yokohama, Shanghai, Penang, and its affiliate office in Israel.

The Alchip Automotive Platform synthesizes six critical services to expedite the design and market launch process for electronic module and device companies in the automotive sector.